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Irregular shaping of polystyrene nanosphere array by plasma etching Cover

Irregular shaping of polystyrene nanosphere array by plasma etching

Open Access
|Aug 2013

References

  1. [1] Zhao Y., Drotar J., Wang G, Lu T., Phys. Rev. Lett., 82 (1999), 4882. http://dx.doi.org/10.1103/PhysRevLett.82.4882
  2. [2] Headrick J., Armstrong M., Cratty J., Hammond S., Sheri B., Berrie C., Langmuir, 21 (2005), 4117. http://dx.doi.org/10.1021/la0481905
  3. [3] Matsui S., Kaito T., Fujita J., Komuro M., Kanda K., Haruyama Y., J. Vac. Sci Technol., 18 (2000), 3181. http://dx.doi.org/10.1116/1.1319689
  4. [4] Vieu C. et al., Appl. Surf. Sci., 164 (2000), 111. http://dx.doi.org/10.1016/S0169-4332(00)00352-4
  5. [5] Van Kan J., Bettiol A., Watt F., Nano Lett., 6 (2006), 579. http://dx.doi.org/10.1021/nl052478c
  6. [6] Haynes C., Van Duyne R., J. Phys. Chem. B, 105 (2001), 5599. http://dx.doi.org/10.1021/jp010657m
  7. [7] Damean N., Parviz B., Lee J., Odom T., Whitesides G., J. Micromech Microeng, 15 (2004), 29. http://dx.doi.org/10.1088/0960-1317/15/1/005
  8. [8] M. Chason, A. Skipor, A. Tungare, D. Gamota, and S. Ghaem, Google Patents, US Patent 6, 649 (2003), 852.
  9. [9] Guldin S. et al., Nano Lett., 10 (2010), 2303. http://dx.doi.org/10.1021/nl904017t
  10. [10] Fu W., Wong K., Choi H., J. Appl. Phys., 107 (2010), 063104. http://dx.doi.org/10.1063/1.3353974
  11. [11] S. Weekes, F. Ogrin, and W. Murray, Langmuir, 20 (2004), 11208. http://dx.doi.org/10.1021/la048695v
  12. [12] Alexe M., Harnagea C., Hesse D., Gosele U., Appl. Phys. Lett., 75 (1999), 1793. http://dx.doi.org/10.1063/1.124822
  13. [13] Li H., Marlow F., Chem. Mater., 18 (2006), 1803. http://dx.doi.org/10.1021/cm052294z
  14. [14] Jiang P., Mcfarland M., J. Am. Chem. Soc., 126 (2004), 13778. http://dx.doi.org/10.1021/ja0470923
  15. [15] Moon G. et al., ACS Nano, 5 (2011), 8600. http://dx.doi.org/10.1021/nn202733f
  16. [16] Okubo T., J. Chem. Phys., 95 (1991), 3690. http://dx.doi.org/10.1063/1.460820
  17. [17] Cong C., Junus W., Shen Z., Yu T., Nanoscale research letters, 4 (2009), 1324. http://dx.doi.org/10.1007/s11671-009-9400-0
  18. [18] Yan L., Wang K., Wu J., Ye L., Phys. Chem. B, 110 (2006), 11241. http://dx.doi.org/10.1021/jp057228z
  19. [19] Li Y., Lee E., Cai W., Kim K., Cho S., ACS Nano, 2 (2008), 1108. http://dx.doi.org/10.1021/nn8001483
  20. [20] Ting Y., Liu C., Park S., Jiang H., Nealey P., Wendt A., Polymers, 2 (2010), 649. http://dx.doi.org/10.3390/polym2040649
  21. [21] Fujimura T., Tamura T., Itoh T., Haginoya C., Komori Y., Koda T., Appl. Phys. Lett., 78 (2001), 1478. http://dx.doi.org/10.1063/1.1353844
  22. [22] Xia D., Ku Z., Li D., Brueck S., Chem. Mater., 20 (2008), 1847. http://dx.doi.org/10.1021/cm702644c
  23. [23] Drotar J., Zhao Y., Lu T., Wang G., Phys. Rev. B, 62 (2000), 2118. http://dx.doi.org/10.1103/PhysRevB.62.2118
  24. [24] Chan W., Chason E., J. Appl. Phys., 101 (2007), 121301. http://dx.doi.org/10.1063/1.2749198
  25. [25] Yao J., Guo H., Phys. Rev. E, 47 (1993), 1007. http://dx.doi.org/10.1103/PhysRevE.47.1007
  26. [26] Abraham F. F., Batra I. P., Ciraci S., Phys. Rev. Lett., 60 (1988), 1314. http://dx.doi.org/10.1103/PhysRevLett.60.1314
  27. [27] Zhang G., Wang D., Mohwald H., Nano Lett., 7 (2007), 3410. http://dx.doi.org/10.1021/nl071820d
  28. [28] Ting Y. et al., J. Vac. Sci Technol., 26 (2008), 1684. http://dx.doi.org/10.1116/1.2966433
  29. [29] Wu P., Peng L., Tuo X., Wang X., Yuan J., Nanotechnology, 16 (2005), 1693. http://dx.doi.org/10.1088/0957-4484/16/9/047
DOI: https://doi.org/10.2478/s13536-013-0109-5 | Journal eISSN: 2083-134X (formerly 2083-124X) | Journal ISSN: 2083-1331
Language: English
Page range: 331 - 337
Published on: Aug 29, 2013
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services

© 2013 Hao Luo, Tingting Liu, Jun Ma, Wei Wang, Heng Li, Pengwei Wang, Jintao Bai, Guangyin Jing, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.