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The Effect of Increased Cu Content on Microstructure and Melting of Utilized Sn-0.3Ag-0.7Cu Solder Cover

The Effect of Increased Cu Content on Microstructure and Melting of Utilized Sn-0.3Ag-0.7Cu Solder

Research Papers Faculty of Materials Science and Technology Slovak University of Technology
Volume 26 (2018): Issue 43 (September 2018)
By: Marián Drienovský,  Lýdia Rízeková Trnková,  Roman Čička,  Pavol Priputen,  Marcela Pekarčíková and  Jozef Janovec  
Open Access
|Feb 2019

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DOI: https://doi.org/10.2478/rput-2018-0028 | Journal eISSN: 1338-0532
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Language: English
Page range: 33 - 44
Submitted on: Oct 29, 2018
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Accepted on: Jan 9, 2019
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Published on: Feb 23, 2019
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year
Keywords:
Low-silver Sn–Ag–Cu solder,
intermetallic compound,
solidification,
thermodynamic calculations
Related subjects:
Engineering,
Introductions and overviews,
Engineering, other

© 2019 Marián Drienovský, Lýdia Rízeková Trnková, Roman Čička, Pavol Priputen, Marcela Pekarčíková, Jozef Janovec, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

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