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Thermal Stress of Surface of Mold Cavities and Parting Line of Silicone Molds Cover

Thermal Stress of Surface of Mold Cavities and Parting Line of Silicone Molds

Research Papers Faculty of Materials Science and Technology Slovak University of Technology
Volume 22 (2014): Issue 34 (June 2014)
By: Martin Bajčičák and  Roland Šuba  
Open Access
|Nov 2014

Authors

Martin Bajčičák

martin.bajcicak@stuba.sk

Roland Šuba

roland.šuba@stuba.sk

DOI: https://doi.org/10.2478/rput-2014-0021 | Journal eISSN: 1338-0532
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Language: English
Page range: 7 - 14
Published on: Nov 25, 2014
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year
Keywords:
silicone mold,
thermal stress,
spin casting
Related subjects:
Engineering,
Introductions and overviews,
Engineering, other

© 2014 Martin Bajčičák, Roland Šuba, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

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