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More than Protectionism: Unbundling U.S. Motives in the Trade and Technological War with China Cover

More than Protectionism: Unbundling U.S. Motives in the Trade and Technological War with China

By: Petr Svatoň  
Open Access
|Sep 2025

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DOI: https://doi.org/10.2478/revecp-2025-0002 | Journal eISSN: 1804-1663 | Journal ISSN: 1213-2446
Language: English
Page range: 15 - 28
Published on: Sep 8, 2025
Published by: Mendel University in Brno
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year

© 2025 Petr Svatoň, published by Mendel University in Brno
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.