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Microstructure and mechanical properties of selective laser melted 18Ni300 steel Cover

Microstructure and mechanical properties of selective laser melted 18Ni300 steel

By: Yan Liang,  Luo Qing,  He Yu,  Zhao Huili and  Wang Yuxin  
Open Access
|Dec 2022

Figures & Tables

Fig. 1

SEM (A) and particle size distribution (B) of 18Ni300 powder

Fig. 2

Illustration of the laser scanning strategy

Fig. 3

Microstructure of the longitudinal section under different laser powers: (A): 270 W, (B) 300 W, (C) 320 W, and (D) 360 W

Fig. 4

Effect of laser power on surface hardness

Fig. 5

Standard stretch piece

Fig. 6

Stress–strain curves under different laser powers

Fig. 7

Tensile fracture morphology of printed samples under different laser powers: (A) 270 W, (B) 300 W, (C) 320 W, and (D) 360 W

Fig. 8

Density variation under different laser powers

Fig. 9

SEM image (A) and local magnification (B) of the upper surface of the sample

Fig. 10

Microstructure analysis of EBSD on the upper surface of the sample: (A) IPF maps of 300 W, (A1) GB maps of 300 W; and (B) IPF maps of 360 W, (B1) GB maps of 360 W. IPF, inverse pole diagram

Performance comparison under different laser powers

Laser power (W)Rm (MPa)Rp0.2 (MPa)ɛPa 2
2701,1041,15815.1
3001,1061,06017.6
33099088316.2
36095986614.7

Comparison of the chemical composition of declared, powder, and as-fabricated 18Ni300

Element, wt.%NiMoCoTiCrCSiMn
Powder17.84.58.610.11<0.01<0.0320.002

Formation process parameters of the 18Ni300 powder

Laser power (W)Scanning speed (mm/s)Path spacing (mm)Layer thickness (μm)
2701,0000.1150
3001,0000.1150
3301,0000.1150
3601,0000.1150
DOI: https://doi.org/10.2478/msp-2022-0031 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Language: English
Page range: 64 - 71
Submitted on: Sep 20, 2022
|
Accepted on: Nov 25, 2022
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Published on: Dec 31, 2022
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2022 Yan Liang, Luo Qing, He Yu, Zhao Huili, Wang Yuxin, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.