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Parameter optimization for wire-cut electrical discharge machining of stir cast AA6063 alloy/SiC (black and green) using Taguchi method with grey relational analysis

Materials Science-Poland
Volume 40 (2022): Issue 1 (March 2022)
By:
Open Access
|Jun 2022

Figures & Tables

Fig. 1

XRD patterns of (A) SiCb, (B) SiCg, and (C) AA6063. XRD, X-ray diffraction
XRD patterns of (A) SiCb, (B) SiCg, and (C) AA6063. XRD, X-ray diffraction

Fig. 2

SEM images of (A) SiCb and (B) SiCg. SEM, scanning electron microscopy
SEM images of (A) SiCb and (B) SiCg. SEM, scanning electron microscopy

Fig. 3

Influence of the input factors on the S/N ratio of (A) MRR-1, (B) Ra-1, (C) MRR-2, and (D) Ra-2. MRR-1, material removal rate; Ra, surface roughness; S/N, signal-to-noise
Influence of the input factors on the S/N ratio of (A) MRR-1, (B) Ra-1, (C) MRR-2, and (D) Ra-2. MRR-1, material removal rate; Ra, surface roughness; S/N, signal-to-noise

Fig. 4

SEM micrographs of WEDM-processed surfaces: (A, B) AA6063/SiCb and (C, D) AA6063/SiCg. SEM, scanning electron microscopy; WEDM, wire-cut electrical discharge machining
SEM micrographs of WEDM-processed surfaces: (A, B) AA6063/SiCb and (C, D) AA6063/SiCg. SEM, scanning electron microscopy; WEDM, wire-cut electrical discharge machining

Fig. 5

Texture analysis from Figure 4B (i–iii) and Figure 4D (iv–vi) at three different positions using Gwyddion image processing software (the red arrow denotes the 100-count mark)
Texture analysis from Figure 4B (i–iii) and Figure 4D (iv–vi) at three different positions using Gwyddion image processing software (the red arrow denotes the 100-count mark)

Fig. 6

EDX mapping analysis over the machined surface of AA6063/SiCb. EDX, energy dispersive X-ray spectroscopy; C, carbon; O, oxygen; Mg, magnesium; Al, aluminium; Si, silicon
EDX mapping analysis over the machined surface of AA6063/SiCb. EDX, energy dispersive X-ray spectroscopy; C, carbon; O, oxygen; Mg, magnesium; Al, aluminium; Si, silicon

Fig. 7

EDX mapping analysis over the machined surface of AA6063/SiCg. EDX, energy dispersive X-ray spectroscopy; C, carbon; O, oxygen; Mg, magnesium; Al, aluminium; Si, silicon
EDX mapping analysis over the machined surface of AA6063/SiCg. EDX, energy dispersive X-ray spectroscopy; C, carbon; O, oxygen; Mg, magnesium; Al, aluminium; Si, silicon

Fig. 8

SEM micrograph of debris generated from (A and B) AA6063/SiCb and (C and D) AA6063/SiCg. EDX analysis of debris generated from (E) AA6063/SiCb and (F) AA6063/SiCg. EDX, energy dispersive X-ray spectroscopy; SEM, scanning electron microscopy
SEM micrograph of debris generated from (A and B) AA6063/SiCb and (C and D) AA6063/SiCg. EDX analysis of debris generated from (E) AA6063/SiCb and (F) AA6063/SiCg. EDX, energy dispersive X-ray spectroscopy; SEM, scanning electron microscopy

Fig. S1

Experimental vs predicted values for (A) MRR-1, (B) Ra-1, (C) MRR-2, and (D) Ra-2. MRR, material removal rate; Ra, surface roughness
Experimental vs predicted values for (A) MRR-1, (B) Ra-1, (C) MRR-2, and (D) Ra-2. MRR, material removal rate; Ra, surface roughness

Grey relational analysis for the WEDM process of AA6063/SiCb

Experimental dataNormalized dataGrey relational coefficientsGRG-1Rank
MRR-1Ra-1MRR-1Ra-1MRR-1Ra-1
8.571.8800.6130.3330.5640.4499
9.091.590.1030.7590.3580.6750.5167
9.781.110.2401.0000.3971.0000.6981
10.511.650.3850.7290.4480.6480.5486
11.231.670.5280.7190.5140.6400.5775
11.862.450.6530.3270.5900.4260.5088
13.252.560.9290.2710.8750.4070.6414
13.523.090.9820.0050.9660.3340.6503
13.613.101.0000.0001.0000.3330.6672

Experimental design for L9 orthogonal array and the experimental data

Sl. no.TONWFFPAA6063/SiCbAA6063/SiCg
MRR-1 (mm3/min)Ra-1 (μm)MRR-2 (mm3/min)Ra-2 (μm)
150618.571.888.811.82
2501229.091.599.271.63
3501839.781.119.941.24
4756210.511.6510.831.69
57512311.231.6711.191.81
67518111.862.4511.982.40
71006313.252.5613.052.72
810012113.523.0913.663.05
910018213.613.1014.133.17

ANOVA for MRR-1, Ra-1, MRR-2, and Ra-2

ResponseSourceDFAdj. SSF-valueP-value
MRR-1R2 = 99.65%TON227.9286268.490.004
WF21.421613.670.068
FP20.19401.870.349
Error20.1040
Total829.6483
Ra-1R2 = 96.64%TON23.0761622.980.042
WF20.054290.410.712
FP20.721425.390.157
Error20.13389
Total83.98576
MRR-2R2 = 97.82%TON227.43321818.100.001
WF21.8955125.620.008
FP20.01380.910.523
Error20.0151
Total829.3575
Ra-2R2 = 96.26%TON23.1964722.690.042
WF20.056270.400.715
FP20.375202.660.273
Error20.14087
Total83.76880

Input machining parameters for both AA6063/SiCg and AA6063/SiCb composites and their levels

FactorSymbolUnitsLevel
Level 1Level 2Level 3
Pulse on timeTONμs5075100
Wire FeedWFm/min61218
Flushing PressureFPMPa123

Grey relational analysis for the WEDM process of AA6063/SiCg

Experimental dataNormalized dataGrey relational coefficientsGRG-1Rank
MRR-2Ra-2MRR-2Ra-2MRR-2Ra-2
8.811.8200.6990.3330.6250.4799
9.271.630.0860.7980.3540.7120.5337
9.941.240.2121.0000.3881.0000.6941
10.831.690.3790.7670.4460.6820.5644
11.191.810.4470.7050.4750.6290.5526
11.982.400.5960.3990.5530.4540.5048
13.052.720.7970.2330.7110.3950.5535
13.663.050.9120.0620.8500.3480.5993
14.133.171.0000.0001.0000.3330.6672
DOI: https://doi.org/10.2478/msp-2022-0011 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
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Language: English
Page range: 68 - 83
Submitted on: Nov 13, 2021
Accepted on: Apr 11, 2022
Published on: Jun 18, 2022
Published by: Sciendo
In partnership with: Paradigm Publishing Services
Publication frequency: 4 times per year
Keywords:
AA6063,
silicon carbide,
wire-cut electrical discharge machining,
stir cast,
Taguchi method,
grey relational analysis
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2022 R Raj Kumar, Gnana Prasanna, G S Hikku, published by Sciendo
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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