Authors
Jianning Li
College of Electronic and Information Engineering, Hebei University, Baoding, China
Research Center for Computational Materials and Device Simulations, Hebei University, Baoding, China
Fang Wu
College of Electronic and Information Engineering, Hebei University, Baoding, China
Jianying Shi
College of Electronic and Information Engineering, Hebei University, Baoding, China
Lei Ma
College of Electronic and Information Engineering, Hebei University, Baoding, China
Xiaobing Yan
College of Electronic and Information Engineering, Hebei University, Baoding, China
Nan Yang
College of Electronic and Information Engineering, Hebei University, Baoding, China
Bangfu Ding
College of Electronic and Information Engineering, Hebei University, Baoding, China
Shukai Zheng
College of Electronic and Information Engineering, Hebei University, Baoding, China
Research Center for Computational Materials and Device Simulations, Hebei University, Baoding, China