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Thin films of copper phthalocyanine deposited by solution processing methods Cover

Thin films of copper phthalocyanine deposited by solution processing methods

Open Access
|May 2020

Abstract

In this work, we show and discuss the surface structure picture of copper phthalocyanine (CuPc) thin films deposited from trifluoroacetic acid (TFA) solvent onto silicon substrates at ambient conditions by four solution processing methods, namely drop-casting, dip-coating, spin-casting and spray-coating. The CuPc films were studied by AFM, as the main technique, and complemented by micro-Raman spectroscopy. Essentially, such thin films consist of CuPc molecular nanoribbons of a fixed ~1 nm thickness. CuPc molecules are arranged in an in-plane direction and formed in stacks under a defined tilt angle with respect to the substrate surface (monolayer) or underlying CuPc layer (multilayer). The film morphology takes various forms depending on the solution concentration, number of layers, and the deposition method. For instance, the morphology varies from very wide (~600 nm) but flat (~1 nm) ribbons for films prepared by dip-coating to crystallized rod-like features (multi-layered ribbons) when obtained by spray-coating. The factors studied in this paper should be taken into consideration in designing and controlling the criteria for rigorous CuPc film architecture.

DOI: https://doi.org/10.2478/msp-2020-0007 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
Language: English
Page range: 79 - 90
Submitted on: Jun 14, 2018
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Accepted on: Apr 23, 2019
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Published on: May 8, 2020
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2020 Hubert Gojzewski, Fatemeh Ghani, Mirosław Szybowicz, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.