Fig. 1
CV graph with forward and reverse scan [From 5]
Fig. 2
Process flow of gold electrode fabrication
Fig. 3
Gold electrode fabricated on COC substrate
Fig. 4
Process flow of photolithography process for silicon mold
Fig. 5
Process flow of Nickle shim fabrication
Fig. 6
Process flow of injection molded chip
Fig. 7
Schematic of complete fabricated chip
Fig. 8
Complete chip after fabrication and bonding
Fig. 9
Cyclic voltammograms at different scan rates for uncleaned thermally bonded chip
Fig. 10
Cyclic voltammograms at different scan rates for cleaned (with KOH) thermally bonded chip
Fig. 11
Cyclic voltammograms at different scan rates for uncleaned ultrasonically welded chip
Fig. 12
Cyclic Voltammograms at different scan rates for cleaned (with KOH) ultrasonically welded chip
Fig. 13
Impedance spectroscopy for cleaned and uncleaned thermally bonded chip
Fig. 14
Impedance Spectroscopy for cleaned and uncleaned ultrasonically welded chip
Fig. 15
CVs of dopamine detection on unmodified ultrasonically welded chip
Fig. 16
CVs of dopamine detection on MPA modified ultrasonically welded chip
Fig. 17
CVs of dopamine detection on cysteamine. modified thermally bonded chip
Fig. 18
Impedance spectroscopy for dopamine detection on thermally and ultrasonically bonded chip
Fig. 19
Tubing with different dimensions to find the suitable dimension for the flow-injection method
Fig. 20
Influence of different Tubings on flow injection
Fig. 21
Cyclic amperometry results for detection of unknown concentration of ferricyanide analyte
Fig. 22
Cyclic amperometry results for detection of unknown concentration of dopamine analyte