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Insulation diagnosis of power semiconductor using a PCB based microstrip patch-type partial discharge sensor Cover

Insulation diagnosis of power semiconductor using a PCB based microstrip patch-type partial discharge sensor

Open Access
|Apr 2026

Authors

Gyeong-Yeol Lee

gyeongyeollee1@gmail.com

Korea Hydro & Nuclear Power Co., LTD (KHNP), Gyeongju, Republic of Korea

Sung-Wook Kim

number1@silla.ac.kr

Department of Electrical and Electronics Engineering, Silla University, Busan, Republic of Korea
DOI: https://doi.org/10.2478/jee-2026-0014 | Journal eISSN: 1339-309X | Journal ISSN: 1335-3632
Language: English
Page range: 130 - 138
Submitted on: Jan 22, 2026
Published on: Apr 18, 2026
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year

© 2026 Gyeong-Yeol Lee, Sung-Wook Kim, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.