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Area and power efficient divide-by-32/33 dual-modulus pre-scaler using split-path TSPC with AVLS for frequency divider Cover

Area and power efficient divide-by-32/33 dual-modulus pre-scaler using split-path TSPC with AVLS for frequency divider

Journal of Electrical Engineering
Volume 74 (2023): Issue 5 (October 2023)
By: Premananda Belegehalli Siddaiah,  Sahithi Narsepalli,  Sanya Mittal and  Abdur Rehman  
Open Access
|Oct 2023

Authors

Premananda Belegehalli Siddaiah

premanandabs@gmail.com

Department of Electronics and Telecommunication Engineering RV College of Engineering, Bengaluru, India

Sahithi Narsepalli

Department of Electronics and Telecommunication Engineering RV College of Engineering, Bengaluru, India

Sanya Mittal

Department of Electronics and Telecommunication Engineering RV College of Engineering, Bengaluru, India

Abdur Rehman

Department of Electronics and Telecommunication Engineering RV College of Engineering, Bengaluru, India
DOI: https://doi.org/10.2478/jee-2023-0048 | Journal eISSN: 1339-309X | Journal ISSN: 1335-3632
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Language: English
Page range: 403 - 412
Submitted on: Sep 14, 2023
|
Published on: Oct 21, 2023
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year
Keywords:
AVLS,
CMOS,
DMPS,
Split-path TSPC,
TSPC
Related subjects:
Engineering,
Introductions and overviews,
Engineering, other

© 2023 Premananda Belegehalli Siddaiah, Sahithi Narsepalli, Sanya Mittal, Abdur Rehman, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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