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Analysis of SMT component land pad discontinuity effect on the overall transmission line impedance in high-speed applications Cover

Analysis of SMT component land pad discontinuity effect on the overall transmission line impedance in high-speed applications

Journal of Electrical Engineering
Volume 74 (2023): Issue 2 (April 2023)
By: Vaidotas Barzdenas and  Aleksandr Vasjanov  
Open Access
|May 2023

Authors

Vaidotas Barzdenas

vaidotas.barzdenas@vilniustech.lt

Department of Computer Science and Communications Technologies, Vilnius Gediminas Technical University, Vilnius, Lithuania

Aleksandr Vasjanov

aleksandr.vasjanov@vilniustech.lt

Department of Computer Science and Communications Technologies, Vilnius Gediminas Technical University, Vilnius, Lithuania
DOI: https://doi.org/10.2478/jee-2023-0016 | Journal eISSN: 1339-309X | Journal ISSN: 1335-3632
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Language: English
Page range: 122 - 126
Submitted on: Mar 16, 2023
|
Published on: May 8, 2023
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year
Keywords:
SMT discontinuity,
land pad discontinuity,
impedance compensation,
cut-out
Related subjects:
Engineering,
Introductions and overviews,
Engineering, other

© 2023 Vaidotas Barzdenas, Aleksandr Vasjanov, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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