Spiral arrangement: From nanostructures to packaging Cover

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Spiral arrangement: From nanostructures to packaging

Journal of Electrical Engineering

Volume 70 (2019): Issue 1 (February 2019)

By: Vladimír Kolařík, Miroslav Horáček, Alexandr Knápek, Stanislav Krátký, Milan Matějka and Petr Meluzín

Open Access

|Mar 2019

Authors

Vladimír Kolařík

vladimir.kolarik@isibrno.cz

Institute of Scientific Instruments of the CAS, Brno

Miroslav Horáček

Institute of Scientific Instruments of the CAS, Brno

Alexandr Knápek

Institute of Scientific Instruments of the CAS, Brno

Stanislav Krátký

Institute of Scientific Instruments of the CAS, Brno

Milan Matějka

Institute of Scientific Instruments of the CAS, Brno

Petr Meluzín

Institute of Scientific Instruments of the CAS, Brno

DOI: https://doi.org/10.2478/jee-2019-0011 | Journal eISSN: 1339-309X | Journal ISSN: 1335-3632

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Language: English

Page range: 74 - 77

Submitted on: Nov 26, 2018

|

Published on: Mar 2, 2019

Published by: Slovak University of Technology in Bratislava

In partnership with: Paradigm Publishing Services

Publication frequency: 6 issues per year

Keywords:

electron beam lithography,

spiral arrangement,

Related subjects:

Introductions and overviews,

Engineering, other

© 2019 Vladimír Kolařík, Miroslav Horáček, Alexandr Knápek, Stanislav Krátký, Milan Matějka, Petr Meluzín, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

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