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ML-GS: Module Lattice-Based Group Signature Scheme Cover
Open Access
|Dec 2025

Authors

Deng Pan

pandeng@home.hpu.edu.cn

Department of Electronics and Communication Engineering, Beijing Electronic Science and Technology Institute, Beijing, China

Yatao Yang

yy2008@163.com

Department of Electronics and Communication Engineering, Beijing Electronic Science and Technology Institute, Beijing, China
School of Telecommunication Engineering, Xidian University, Xi’an, China

Weitao Sun

3096958887@qq.com

Department of Electronics and Communication Engineering, Beijing Electronic Science and Technology Institute, Beijing, China

Shuaibo Wang

1206048996@qq.com

School of Telecommunication Engineering, Xidian University, Xi’an, China

Ke Wang

wangke_unique@163.com

Department of Electronics and Communication Engineering, Beijing Electronic Science and Technology Institute, Beijing, China
DOI: https://doi.org/10.2478/ias-2025-0007 | Journal eISSN: 1554-1029 | Journal ISSN: 1554-1010
Language: English
Page range: 106 - 124
Published on: Dec 31, 2025
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year

© 2025 Deng Pan, Yatao Yang, Weitao Sun, Shuaibo Wang, Ke Wang, published by Cerebration Science Publishing Co., Limited
This work is licensed under the Creative Commons Attribution-NonCommercial-ShareAlike 4.0 License.