Authors
Deng Pan
Department of Electronics and Communication Engineering, Beijing Electronic Science and Technology Institute, Beijing, China
Yatao Yang
Department of Electronics and Communication Engineering, Beijing Electronic Science and Technology Institute, Beijing, China
School of Telecommunication Engineering, Xidian University, Xi’an, China
Weitao Sun
Department of Electronics and Communication Engineering, Beijing Electronic Science and Technology Institute, Beijing, China
Shuaibo Wang
School of Telecommunication Engineering, Xidian University, Xi’an, China
Ke Wang
Department of Electronics and Communication Engineering, Beijing Electronic Science and Technology Institute, Beijing, China