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A Novel Data Mining Approach for Defect Detection in the Printed Circuit Board Manufacturing Process Cover

A Novel Data Mining Approach for Defect Detection in the Printed Circuit Board Manufacturing Process

Engineering Management in Production and Services
Volume 14 (2022): Issue 2 (June 2022)
By: Blanka Bártová and  Vladislav Bína  
Open Access
|Jul 2022
DOI: https://doi.org/10.2478/emj-2022-0013 | Journal eISSN: 2543-912X | Journal ISSN: 2543-6597
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Language: English
Page range: 13 - 25
Submitted on: Dec 12, 2021
|
Accepted on: May 5, 2022
|
Published on: Jul 11, 2022
Published by: Bialystok University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
quality management,
defect detection,
AOI,
PCA,
PCB,
SVM
Related subjects:
Business and economics,
Business management,
Industries,
Transportation, logistics, air traffic, shipping,
Engineering,
Mechanical engineering,
Production technology,
Process engineering and industrial engineering

© 2022 Blanka Bártová, Vladislav Bína, published by Bialystok University of Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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