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An Analysis of the Structure and Thermal Conductivity of Hollow Microsphere Filled Syntactic Foams Cover

An Analysis of the Structure and Thermal Conductivity of Hollow Microsphere Filled Syntactic Foams

Open Access
|Jun 2019

References

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DOI: https://doi.org/10.2478/cee-2019-0006 | Journal eISSN: 2199-6512 | Journal ISSN: 1336-5835
Language: English
Page range: 36 - 41
Published on: Jun 22, 2019
Published by: University of Žilina
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year

© 2019 Rositsa Petkova-Slipets, Penka Zlateva, published by University of Žilina
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.