Abstract
Mechanical vibrations play a critical role in the performance and long-term durability of electronic systems, especially printed circuit boards (PCBs) operating in harsh environments. This paper presents an overview of recent research focused on fatigue damage and remaining useful life (RUL) estimation of PCBs exposed to random and sinusoidal vibrations. Emphasis is placed on vibration testing and finite element analysis (FEA) as primary tools for evaluating the dynamic behavior of PCBs. Random vibration tests are examined for identifying natural frequencies and participation factors, while power spectral density (PSD) analysis is used to estimate stress levels and fatigue life of solder joints. Predictive models such as the Oh-Park method, Steinberg’s model, Kirchhoff plate theory, and the modal assurance criterion (MAC) are discussed. Finally, the study highlights the integration of these methods with industry standards like ISO-16750-3 and IPC-2221A to enhance mechanical reliability and guide robust PCB design practices under vibrational loading.