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A Study on the Influence of Thermal Interface Material in Passively Cooled Electrical Components with Attached Heatsink

Bulletin of the Polytechnic Institute of Iași. Machine constructions Section
Volume 69 (2023): Issue 1 (March 2023)
By:
Open Access
|Jul 2023
DOI: https://doi.org/10.2478/bipcm-2023-0007 | Journal eISSN: 2537-4869 | Journal ISSN: 1011-2855
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Language: English
Page range: 95 - 104
Submitted on: Apr 2, 2023
Accepted on: Apr 20, 2023
Published on: Jul 22, 2023
Published by: Gheorghe Asachi Technical University of Iasi
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
FEA,
heat sink,
thermal,
passive cooling,
thermal pad,
thermal interface material
Related subjects:
Engineering,
Mechanical engineering,
Fundamentals of mechanical engineering,
Thermodynamics,
Production technology,
Mechatronics and automotive

© 2023 George-Gabriel Chiriac, Cătălin Gabriel Dumitraş, Ionuţ Mertic, published by Gheorghe Asachi Technical University of Iasi
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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