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Numerical Study of Thermal Dissipation Processes in Silicon Cover

Numerical Study of Thermal Dissipation Processes in Silicon

Open Access
|Nov 2022
DOI: https://doi.org/10.2478/bhee-2020-0001 | Journal eISSN: 2566-3151 | Journal ISSN: 2566-3143
Language: English
Page range: 5 - 13
Submitted on: May 1, 2020
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Accepted on: Jun 1, 2020
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Published on: Nov 1, 2022
In partnership with: Paradigm Publishing Services
Publication frequency: 2 issues per year

© 2022 Zlatan Akšamija, published by Bosnia and Herzegovina National Committee CIGRÉ
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.