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DYNAMIC TESTING OF COPPER MATERIAL – NUMERICAL APPROACH Cover

DYNAMIC TESTING OF COPPER MATERIAL – NUMERICAL APPROACH

Acta Mechanica et Automatica
Volume 7 (2013): Issue 4 (December 2013)
By: Paweł Baranowski,  Jerzy Małachowski,  Łukasz Mazurkiewicz and  Krzysztof Damaziak  
Open Access
|Mar 2014
DOI: https://doi.org/10.2478/ama-2013-0033 | Journal eISSN: 2300-5319 | Journal ISSN: 1898-4088
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Language: English
Page range: 196 - 202
Published on: Mar 11, 2014
Published by: Bialystok University of Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
Copper,
Compression,
FE Analysis,
SHPB
Related subjects:
Engineering,
Electrical engineering,
Electronics,
Mechanical engineering,
Mechanics,
Bioengineering and biomedical engineering,
Biomechanics,
Civil engineering,
Environmental engineering

© 2014 Paweł Baranowski, Jerzy Małachowski, Łukasz Mazurkiewicz, Krzysztof Damaziak, published by Bialystok University of Technology
This work is licensed under the Creative Commons License.

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