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Design and Experimental Validation of Compact NFC Antenna and Embedded SiP RFID Module Based on LTCC and PCB Technologies Cover

Design and Experimental Validation of Compact NFC Antenna and Embedded SiP RFID Module Based on LTCC and PCB Technologies

Open Access
|Jun 2026

Abstract

This paper presents the design, fabrication, and experimental validation of compact NFC antenna structures and a miniaturized RFID module based on System-in-Package (SiP) integration. Planar spiral antennas operating at 13.56 MHz are implemented on LTCC and PCB substrates using two-layer and three-layer configurations. The influence of substrate material, geometry, and tuning strategy on inductance, resonance frequency, reflection coefficient, and Q-factor is experimentally evaluated using vector network analysis. A compact RFID module is subsequently realized using a cavity-based SiP architecture with face-down chip integration and anisotropic conductive film (ACF) interconnection. The results demonstrate that substrate selection and integration strategy significantly affect electrical performance, coupling efficiency, and miniaturization limits, providing a practical basis for the development of embedded SiP RFID/NFC modules.

DOI: https://doi.org/10.2478/aei-2026-0011 | Journal eISSN: 1338-3957 | Journal ISSN: 1335-8243
Language: English
Page range: 55 - 63
Submitted on: Apr 15, 2026
Accepted on: May 28, 2026
Published on: Jun 17, 2026
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2026 Alena Pietriková, Igor Vehec, Tomáš Lenger, Peter Lukács, published by Technical University of Košice
This work is licensed under the Creative Commons Attribution 4.0 License.