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Simulation of Radial Temperature Field of Overhead Conductors on Qinghai-Tibet Plateau Cover

Simulation of Radial Temperature Field of Overhead Conductors on Qinghai-Tibet Plateau

Open Access
|Nov 2024
DOI: https://doi.org/10.2478/aei-2024-0012 | Journal eISSN: 1338-3957 | Journal ISSN: 1335-8243
Language: English
Page range: 3 - 10
Published on: Nov 17, 2024
Published by: Technical University of Košice
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year

© 2024 Hongwei Zhang, Yongdou Liu, Zhilei Han, Junpeng Luo, Shengkun Liu, published by Technical University of Košice
This work is licensed under the Creative Commons Attribution 4.0 License.