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Open Access
|Feb 2020

Abstract

Copper becomes more and more important in the electronic industry. This metal is more resilient than conventional materials (like aluminium) due to the higher electrical and thermal conductivity. During several electrical stress pulses the copper changes. The surface can melt up and cracks and voids can develop inside the copper specimen.

In this paper we use acoustic emission testing to analyse copper degradation especially of copper and copper traces. It is evaluated if an acoustic wave excited by a thermo-electrical stress pulse can be detected by a simple measurement setup and if a correlation between the acoustic signal and the degradation exists. The idea is that during the degradation, the behaviour of the material changes which in turn influences the emitted acoustic signal.

Language: English
Page range: 1 - 6
Published on: Feb 15, 2020
Published by: Professor Subhas Chandra Mukhopadhyay
In partnership with: Paradigm Publishing Services
Publication frequency: 1 times per year

© 2020 Daniela Florian, Thomas Wiesner, Bernhard G. Zagar, published by Professor Subhas Chandra Mukhopadhyay
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.