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A Method For Fine Bonding Wire Detection Using Light Diffraction Cover

A Method For Fine Bonding Wire Detection Using Light Diffraction

International Journal on Smart Sensing and Intelligent Systems
Volume 4 (2011): Issue 1 (January 2011)
By: Yong Xiao,  Xiaoyan Wang,  Kuanyi Zhu,  Xiaoyu Ge and  Jingna Sun  
Open Access
|Dec 2017

Authors

Yong Xiao

xiaoyong@syuct.edu.cn

College of Information Engineering, Shenyang University of Chemical Technology, Shenyang, China

Xiaoyan Wang

College of Information Engineering, Shenyang University of Chemical Technology, Shenyang, China

Kuanyi Zhu

Dept.of Electronic and Computer Engineering, Ngee Ann Polytechnic, Singapore

Xiaoyu Ge

College of Information Engineering, Shenyang University of Chemical Technology, Shenyang, China

Jingna Sun

College of Information Engineering, Shenyang University of Chemical Technology, Shenyang, China
DOI: https://doi.org/10.21307/ijssis-2017-429 | Journal eISSN: 1178-5608
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Language: English
Page range: 112 - 124
Submitted on: Dec 2, 2010
Accepted on: Feb 1, 2011
Published on: Dec 12, 2017
Published by: Professor Subhas Chandra Mukhopadhyay
In partnership with: Paradigm Publishing Services
Publication frequency: 1 issue per year
Keywords:
Bonding wire,
diffraction,
slot,
and irradiance
Related subjects:
Engineering,
Introductions and overviews,
Engineering, other

© 2017 Yong Xiao, Xiaoyan Wang, Kuanyi Zhu, Xiaoyu Ge, Jingna Sun, published by Professor Subhas Chandra Mukhopadhyay
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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