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Effect of Ag on Sn–Cu and Sn–Zn lead free solders

Materials Science-Poland
Volume 33 (2015): Issue 2 (June 2015)
By:
Open Access
|Jul 2015

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DOI: https://doi.org/10.1515/msp-2015-0048 | Journal eISSN: 2083-134X | Journal ISSN: 2083-1331
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Language: English
Page range: 317 - 330
Submitted on: Aug 14, 2014
Accepted on: Feb 11, 2015
Published on: Jul 11, 2015
Published by: Wroclaw University of Science and Technology
In partnership with: Paradigm Publishing Services
Publication frequency: 4 issues per year
Keywords:
Sn-Cu,
Sn-Zn,
Sn-Cu-Ag,
Sn-Zn-Ag,
eutectic alloys,
thermal analysis
Related subjects:
Materials sciences,
Materials sciences, other,
Nanomaterials,
Functional and smart materials,
Materials characterization and properties

© 2015 S.N. Alam, Prerna Mishra, Rajnish Kumar, published by Wroclaw University of Science and Technology
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 3.0 License.

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