Abstract
Copper is widely used metal for industrial and public purposes due to its good corrosion resistance and excellent electrical conductivity. In indoor atmospheric environments with low level of air pollution the corrosion rate of copper is very low and it is not affected by slight increasing of temperature or relative humidity. In many indoor environment hydrogen sulphide (H2S) occurs and significantly affects the copper corrosion. CuS is a loose of black corrosion product which can’t form protective film on copper surface and promote corrosion by adsorption of moisture as carrier. In sulphide presence, the corrosion product is chalcocite Cu2S. Copper corrosion attack by H2S low concentration caused significant failure of electronic, electric equipment but also other copper parts as tubes, etc. These corrosion films can form an insulating layer on the contact surfaces causing electrical failures on the electronic devices.