Authors
Rajdi Agalliu
Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Telecommunications Engineering, Prague 6
Catalina Burtscher
Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Telecommunications Engineering, Prague 6
Vorarlberg University of Applied Sciences, Research Centre for Microtechnology, Dornbirn, Austria
Michal Lucki
Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Telecommunications Engineering, Prague 6
Dana Seyringer
Vorarlberg University of Applied Sciences, Research Centre for Microtechnology, Dornbirn, Austria