Have a personal or library account? Click to login
Analysis of the transients on the multi-circuit overhead transmission line Cover

Analysis of the transients on the multi-circuit overhead transmission line

Open Access
|Jan 2018

References

  1. [1] W. Liu, M. Pan, K. Liu and G. Xu, “Research on Electromagnetic Character of 500/220 kV Mixed-voltage Quadruple-circuit Transmission Line”, 12th International Conference on Environmental and Electrical Engineering EEEIC 2013.
  2. [2] A. Novitskiy and D. Westermann, “Interaction of Multi-Circuit Overhead Transmission Lines of Different Voltages Located on the Same Pylon”, Electric Power Quality and Supply Reliability Conference (PQ), 2012.10.1109/PQ.2012.6256240
  3. [3] B. Gustavsen, “Modal Domain-Based Modeling of Parallel Transmission Lines With Emphasis on Accurate Representation of Mutual Coupling Effects”, IEEE Transaction on Power Delivery, 2012.10.1109/TPWRD.2012.2202923
  4. [4] M. Kollar, “Active Homogenous Line with Arbitrary Distributed Sources”, Journal of Electrical Engineering, vol.52, no.9-10, 2001.
  5. [5] Z. Benesova and D. Mayer, “Algorithm for Computation of Inductances of Three-Phase Overhead Lines”,, AMTEE’03 Plzeň: ZČU v Plzni 2003.
  6. [6] Z. Benesova and L. Sroubova, “Capacitive Coupling Double-Circuit Transmission Lines”, Advances Electrical and Electronic Engineering, Žilina 2004.
  7. [7] R. Rudenberg, Transient Performance of Electric Power Systems first edition, McGraw-Hill Book Company, New York, pp. 393–408, 1950.
  8. [8] T. Nazarcik and Z. Benesova, “Analysis of Electromagnetic Field a Vicinity of Multi-Circuit Overhead Lines with Different Voltage Level”, 19th International Symposium on High Voltage Engineering, Pilsen, Czech Republic, 2015.
DOI: https://doi.org/10.1515/jee-2017-0083 | Journal eISSN: 1339-309X | Journal ISSN: 1335-3632
Language: English
Page range: 476 - 481
Submitted on: Oct 26, 2017
Published on: Jan 19, 2018
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year

© 2018 Tomáš Nazarčík, Zdeňka Benešová, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.