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Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics Cover

Simulation of cooling efficiency via miniaturised channels in multilayer LTCC for power electronics

Journal of Electrical Engineering
Volume 68 (2017): Issue 2 (March 2017)
By: Alena Pietrikova,  Tomas Girasek,  Peter Lukacs,  Tilo Welker and  Jens Müller  
Open Access
|May 2017

Authors

Alena Pietrikova

alena.pietrikova@tuke.sk

Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Košice, Košice, Slovakia

Tomas Girasek

Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Košice, Košice, Slovakia

Peter Lukacs

Department of Technologies in Electronics, Faculty of Electrical Engineering and Informatics, Technical University of Košice, Košice, Slovakia

Tilo Welker

Electronics Technology Group, Technical University of Ilmenau, Ilmenau, Germany

Jens Müller

Electronics Technology Group, Technical University of Ilmenau, Ilmenau, Germany
DOI: https://doi.org/10.1515/jee-2017-0018 | Journal eISSN: 1339-309X | Journal ISSN: 1335-3632
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Language: English
Page range: 132 - 137
Submitted on: Apr 10, 2016
Published on: May 11, 2017
Published by: Slovak University of Technology in Bratislava
In partnership with: Paradigm Publishing Services
Publication frequency: 6 issues per year
Keywords:
thermal simulation,
thermal resistance,
LTCC,
cooling channels
Related subjects:
Engineering,
Introductions and overviews,
Engineering, other

© 2017 Alena Pietrikova, Tomas Girasek, Peter Lukacs, Tilo Welker, Jens Müller, published by Slovak University of Technology in Bratislava
This work is licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 License.

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